Modeling and simulation of dipped textile cords: Investigating the role of glue in bending response

This work proposes a mesoscopic finite element modeling approach that captures the mechanical effects of glue coatings in textile cords. The main contributions include the development of a novel contour selection algorithm tailored for textile cables and the implementation of 3D constraints based on a stiffness formulation that accounts for the geometry of the adhesive layer between filaments. The model has been applied to the case study of three-point bending of dipped textile cords. It demonstrates a good agreement with experimental results, marking a significant step forward in the simulation of textile cords. Different glue configurations have been explored by varying the stiffness and penetration depth of the adhesive. The results highlight the stiffening effect of the glue on the bending response of the cord. Additionally, the study also shows a link between the glue coating and the frictional energy dissipated in the cord, and it offers insights into how the adhesive layer deforms.