Material chemistry

In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint

Publié le 31 mars 2022 - Journal of Electronic Materials

Auteurs : L. Cornet, L. Yedra, É. Héripré, V. Aubin, J.-H. Schmitt, M.-L. Giorgi